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Fast Facts

The 29th Advances in Resist Materials and Processing Technology Conference (AL104)

Feb 12, 2012 - Feb 16, 2012,
San Jose Marriott and San Jose Convention Center, San Jose, California United States

This conference welcomes submissions of original papers that emphasize recent advances in high-performance resist materials in established, maturing, emerging, and new lithographic technologies. The subjects of interest include resist design, resist synthesis and performance, resist processing techniques and engineering, resist structure-property relationships, and resist process modeling and simulation. Of particular interest are papers that correlate basic material properties with lithographic performance characteristics, such as sensitivity, resolution, process latitude, etch resistance, line edge roughness, and device integration. In addition, new and novel applications of resists in non-traditional imaging areas will also be included.

This conference is recognized as the leading forum for the presentation and discussion of research on the chemistry, physics, and performance of resist materials and related processes. Consistent with the conference's charter and goals, authors are required to provide a description of the chemical and physical principles, as well as the chemical structures of the resist materials, in the reported work. Papers which do not reveal sufficient chemical details so as to add value to the readers or are of principally commercial nature may not be accepted for presentation and publication.

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Biology of Gordon Research Conference 2012: The Aging

Feb 12, 2012 - Feb 17, 2012,
Ventura Beach Marriott, Ventura, California United States

The Aging, Biology of Gordon Research Conference will be held in conjunction with the Aging, Biology of Gordon Research Seminar. Those interested in attending both meetings must submit an application for the GRS in addition to an application for the GRC. Please refer to the Aging, Biology of GRS web page for more information.

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The 26th Metrology, Inspection, and Process Control for Microlithography Conference (AL103)

Feb 12, 2012 - Feb 16, 2012,
San Jose Marriott and San Jose Convention Center, San Jose, California United States

Metrology based learning, segmentation, and tighter control of error sources continue to enable rapid evolution of optical microlithography. Direct metrology of exposure dose and focus supports ever smaller process windows. Dimensional metrology in layouts is critical for resolution enhancement. Extremely tight overlay is required for double exposure. Development of new materials, equipment, and processes for EUV lithography, nano-imprint, and directed self-assembly also drive innovation of metrology equipment and applications methods.

This conference on is the leading forum for the exchange of foundational information and discussion of novel concepts in patterning related metrology and inspection.

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SPIE Advanced Lithography 2012

Feb 12, 2012 - Feb 16, 2012,
San Jose Marriott and San Jose Convention Center, San Diego, California United States

The chip industry continues to name lithography as a critical challenge in fabricating next generation integrated circuits. Today, lithographers are challenged with extending immersion lithography to physical limits, while striving to bring newer technologies, such as EUV lithography, to production readiness. Success will demand ingenuity, cost efficiency and communication within the lithography community and across interdisciplinary lines.

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The 25th Optical Microlithography Conference (AL105)

Feb 12, 2012 - Feb 16, 2012,
San Jose Marriott and San Jose Convention Center, San Jose, California United States

While EUV lithography is maturing, optical lithography is expected to continue as the primary lithographic technology for manufacturing over the next several years. Extension of water-based immersion lithography to below 32 nm half-pitch requires the use of innovative resolution enhancement techniques, solutions to complexities introduced by hyper-NA optics, and extensive use of double or multiple sequential exposure and patterning techniques. In addition to resolution, very tight overlay control and high quality photomasks are also necessary. The successful use of optics to provide viable working solutions for these device nodes will require fundamental integration of all aspects of the patterning process. The cost of advanced lithography is another concern that is in need of creative solutions, such as "freezing" first resist in double patterning approach.

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The 4th Design for Manufacturability through Design-Process Integration Conference (AL106)

Feb 12, 2012 - Feb 16, 2012,
San Jose, California United States

Increasingly, advanced semiconductor designs must be aware of new process-driven constraints. Moreover, the manufacturing process must be driven by design intent information that goes beyond layout geometry. This conference, aimed at technical and management professionals engaged with the interface between integrated circuit design and manufacturing, invites articles that examine novel approaches for design and process integration aimed at "more Moore" enablement, fast turn-around, cost-effectiveness, and high-yielding integrated circuit (IC) creation.

Contributions should emphasize fundamentals of technical solutions rather than their commercial embodiments. Submissions in design-for manufacturability (DfM), circuit and yield characterization, and other interdisciplinary studies, including but not limited to those based on electronic design automation (EDA), are welcome.

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Advanced Etch Technology for Nanopatterning Conference (AL107)

Feb 12, 2012 - Feb 16, 2012,
San Jose, California United States

Success of the semiconductor industry has been driven by the relentless pursuit of technological innovations. The continuous drive to improve device features, enhance performance and simultaneously reduce manufacturing costs is incessant. While optical lithography has traditionally been the major driving force for technology advancement, other relevant technologies and improved synergy amongst them have lately become increasingly important. One such technology is plasma-etch and the associated patterning process. While it has always been an integral part of semiconductor technology, plasma etch has taken on an increasingly important role with the advent of double-patterning and pitch-split (DP/PS) technologies for the 22-nm generation and beyond.

The annual SPIE Advanced Lithography symposium is recognized as the leading forum for the presentation and discussion of research results related to nanopatterning for semiconductor manufacturing. As such, we are striving to establish this conference as the main platform to present and discuss recent advances in patterning technology with a focus on plasma-etch and related processes. Consistent with the conference's charter and goals, authors are required to provide a description of the chemical and physical principles.

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The 3rd Extreme Ultraviolet (EUV) Lithography Conference 2012 (AL101)

Feb 12, 2012 - Feb 16, 2012,
San Jose Marriott and San Jose Convention Center, San Jose, California United States

A number of full-field EUV pre-production tools are being installed at customer sites in 2011. EUV Lithography technology will be rapidly transitioning from R&D to pilot production. Since full-field EUV High Volume Manufacturing tools are expected in 2012, very little time remains to address the remaining EUV infrastructure challenges, i.e., fielding sources with the power and reliability required for productive exposure tool throughput, mitigating any remaining mask blank defects, and developing manufacturing ready resists.

In addition to the challenges related to the introduction of EUVL into manufacturing, many fundamental challenges remain with respect to the extendibility of the technology to 11 nm and beyond.

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The 4th Alternative Lithographic Technologies Conference 2012 (AL102)

Feb 12, 2012 - Feb 16, 2012,
San Jose Marriott and San Jose Convention Center, San Jose, California United States

Our conference showcases novel lithographic techniques that provide non-optical or other emerging patterning solutions for applications that are scaled (i.e. 16-nm technology ITRS IC nodes and beyond), scaling-independent, or non-IC related. Successful adoption of a technique by one application would synergistically benefit others through improvements in processing capabilities and technological infrastructure, leading to reduced manufacturing costs.

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Electric Vehicles: Understand the Rise of eMobility

Feb 12, 2012 - Feb 13, 2012,
Copthorne Tara Hotel United Kingdom

With global sales for Electric Vehicles predicted to increase by over 100% in the next 3 years, the market is growing and developing globally. An investment of €5 billion has been planned by European governments for EV public charging points, but this investment will not be adequate. Cross-industry partnerships and regulated clarification are vital to help implementation.

Make sure you don’t miss SMi’s Electric Vehicles event, which will be the central hub bringing the industry together to make real business decisions that will impact the future of the market.

This conference willl address perspectives from the industry, government, utilties, automotive, and consumer sectors to enable attendees a full and in-depth overview of the current value chain.

View Our Expert Speakers:

• John McVeagh, Senior Representative, OLEV
• Onoph Caron, CEO, E-Laad
• Nigel Fox, Contracts and Settlements Manager, National Grid
• Sara Bell, Head of Commercial Strategy, UK Power Networks                
• Roger Hey, Energy Project Manager, Western Power Distribution
• John Lowes, Senior Engineer & Charging Infrastructure Specialist, Nissan & CHARGEYOURCAR
• Dean Keeling, Managing Director Smart Homes, British Gas
• Philip Evans, Head of Mobility, Npower
• Kate Armitage, Electric Vehicles Team Manager, EDF Energy
• David Densley, Head of Sustainable Transport, SSE
• Samantha Kennedy, Head of Strategy and Stakeholder Partnerships, Transport for London
• Senan McGrath, Chief Technology Officer, ESB
• Danny Geldtmeijer, Innovator, Enexis
• Anders Bavnhøj Hansen, Civil Engineer, Energinet.dk
• Ian Allen, Manager Environmental Strategy, Vauxhall Motors
• Brian McBeth, Project Manager Business Development e-Mobility, Daimler
• Goran Strbac, Professor of Electrical Energy Systems, Imperial College London
• Arne Richters, Manager Clean Cars, Transport and Environment
• Ingo Bunzeck, Coordinator Transport ECN, Energy Research Centre of the Netherlands
• Ann Marker, Communications, ChoosEV
• Linda Christensen, Senior Researcher, DTU
• Jorgen Christensen, Chefkonsulent, Dansk Energi
• Laerke Flader, Managing Director, Danish Electric Vehicle Alliance
• Mark Burgess, Professor, Oxford Brookes University
• John Batterbee, Manager - Transport Programme, Energy Technologies Institute                             
• Gerry Wardell, Director, Codema

PLUS A HALF DAY POST CONFERENCE WORKSHOP ON:
The Electric Vehicles Jigsaw
A cross industry perspective on the challenges and opportunities ahead

In association with: MVA Consultancy

15th February 2012, Copthorne Tara Hotel, London 

PLUS A HALF DAY POST CONFERENCE WORKSHOP ON:
The Electric Vehicles Jigsaw
A cross industry perspective on the challenges and opportunities ahead

In association with: MVA Consultancy

15th February 2012, Copthorne Tara Hotel, London

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The Plasminogen Activation & Extracellular Proteolysis Gordon Research Conference 2012

Feb 12, 2012 - Feb 17, 2012,
Four Points Sheraton/Holiday Inn Express, Ventura, California United States

The Plasminogen Activation & Extracellular Proteolysis Gordon Research Conference will be held in conjunction with the Plasminogen Activation & Extracellular Proteolysis Gordon Research Seminar. Those interested in attending both meetings must submit an application for the GRS in addition to an application for the GRC. Please refer to the Plasminogen Activation & Extracellular Proteolysis GRS web page for more information.

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