GoingToMeet

During last decade, both International Conference on Electronic Packaging Technology (ICEPT), organized by China Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS), and International Symposium on High Density Packaging (HDP), organized by Shanghai University, have provided a great technical platform for both abroad and domestic experts, scholars and researchers from academia and industries to exchange the ideas in the new developments of electronics packaging. It has been decided IEEE-CPMT and CIE-CEPS, ICEPT and HDP are merged as International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) this year in order to meet the requirements of rapidly growing packaging industry in China.