GoingToMeet

Driving forces in microelectronics are the miniaturization processes with steadily increasing service temperatures, temperature gradients and cooling requirements. With this drive new processes and technologies are developed to achieve highly localized tailored thermo mechanical properties. This has been developed down to the nanoscale in frontend processes of the chip industry.

From the material point of view newly developed nanostructured materials, nanoparticle or nanotube filled structural materials are finding their application in electronics packaging as underfil of thermal interface materials.

In addition with the emerging sector of bionanotechnology, the development and evaluation of interface concepts of biological structures to microelectronic materials such as polymers, metals, ceramics and semi-conducting materials will be a fundamental challenge.

Simulative and experimental methods for the reliability assessment of products with nanotechnological processes or functionalities are the key for successful product design.

The symposium is focussed on reliability tasks of chip design, MEMS and NEMS were nano or microstructural effects are dominating factors for reliability and lifetime. Novel testing methods for thermo mechanical characterization of the building blocks of nanotechnology are also addressed. Nanoreliability approaches from other sectors are also welcome to provide an overview of experimental and numerical concepts for nanotechnology applications.