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Fast Facts

SMT/HYBRID/Packaging 2008: System Integration in Micro Electronics

Jun 03, 2008 - Jun 05, 2008
Exhibition Centre Nuremberg, Nurnberg, Bayern Germany
 

Highlights

Traditionally the SMT/HYBRID/PACKAGING forms the ideal platform for the industry's leading companies. Among other things the show presents the latest trends and developments as well as up-to-date solutions. With foreign companies accounting for 33% of the exhibitors, the event offers not only a wide, but also an international spectrum. And you too, can benefit from the success of this well-established event! The highly qualified audience from over 50 countries rated the exhibition extremely positively.

From design and development to PCB production, components, packaging and test systems - SMT/HYBRID/PACKAGING offers a comprehensive and compact presentation of products all under one roof!










Contact Details

Contact person: Udo Weller
Event website: http://www.mesago.de/en/SMT/main.htm
Phone: +49 711 61946-74
Fax: +49 711 61946-93

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